Precision Wafering Blade

Metal Bond (MB) – Is a hard bond, which is required when cutting aggressive materials such as ceramics, refractories, glass, and rock. Metal Bond has a depth of abrasive generally 1/8”. A low concentration is favored to allow the blade to cut more freely. High concentrations are required when cutting aggressive materials such as ceramics.
Resin Bond (RB) – Is a softer, more forgiving bond matrix. Resin Bond is effective when cutting harder, denser materials like carbide. A better finish can be achieved than with the electroplated or metal bond wheels. Generally, all cutting and slicing operations use high concentration.
Diamond Wafering Blades – Metal Bond High Concentration
Recommended for general metallographic sectioning, excluding ferrous alloys, at either low (<1,000 RPM) or high (>1,000 RPM) speeds.
| Diameter | Arbor | Thickness | Abrasive Type | Pack | Order Code. |
| 75 | 12.7 | 0.4 | Metal Bond | 1 | 01-081075 |
| 100 | 12.7 | 0.4 | Metal Bond | 1 | 01-081100 |
| 125 | 12.7 | 0.4 | Metal Bond | 1 | 01-081125 |
| 150 | 12.7 | 0.5 | Metal Bond | 1 | 01-081150 |
| 180 | 12.7 | 0.8 | Metal Bond | 1 | 01-081180 |
| 200 | 12.7 | 0.8 | Metal Bond | 1 | 01-081200 |
| 200 | 32 | 1.2 | Metal Bond | 1 | 01-082200 |
| 250 | 32 | 1.3 | Metal Bond | 1 | 01-081250 |
| 300 | 32 | 1.6 | Metal Bond | 1 | 01-081300 |
| 350 | 32 | 1.8 | Metal Bond | 1 | 01-081355 |
Diamond Wafering Blades – Metal Bond Low Concentration
Recommended for cutting very hard or brittle materials such as ceramics, silicon, glass and refractories where chipping and pullout need to be minimized. Most commonly used at lower (<1,000 RPM) speeds.
CBN Wafering Blades - Metal Bond
Recommended for sectioning hard steel, and iron, cobalt, nickel and lead based alloys. Most commonly used at lower (<1,000 RPM) speeds.
| Diameter | Arbor | Thickness | Abrasive Type | Pack | Order Code. |
| 75 | 12.7 | 0.2 | Metal Bond | 1 | 01-111075 |
| 100 | 12.7 | 0.4 | Metal Bond | 1 | 01-111100 |
| 125 | 12.7 | 0.5 | Metal Bond | 1 | 01-111125 |
| 150 | 12.7 | 0.5 | Metal Bond | 1 | 01-111150 |
| 175 | 12.7 | 0.7 | Metal Bond | 1 | 01-111175 |
| 200 | 12.7 | 0.8 | Metal Bond | 1 | 01-111200 |
| 200 | 32 | 1.2 | Metal Bond | 1 | 01-112200 |
| 250 | 32 | 1.3 | Metal Bond | 1 | 01-111250 |
| 300 | 32 | 1.6 | Metal Bond | 1 | 01-111300 |
| 350 | 32 | 1.8 | Metal Bond | 1 | 01-111355 |
CBN Wafering Blades - Resin BondRecommended for sectioning hard steel above HRC 60. Most commonly used at higher (>1,000 RPM) speeds.
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